OSAT Chip Packaging Summit 2027
- Date
- 19 Jan 2027
- Venue
- Marina Bay Sands Expo
- Organizer
- IGEN News Editorial
10:00 IST
Singapore
1,305 expected
About this event
OSAT Chip Packaging Summit 2027 brings together exporters, policymakers, investors and technology providers to work through what is changing in semiconductors and what to do about it. The programme is built around practical sessions rather than speeches.
Delegates leave with a shortlist of buyers and partners, a clear reading of upcoming notifications, and access to the IGEN briefing pack and recordings.
Agenda
10:00 IST
Registration and networking breakfast
Badge pick-up, buyer-seller lounge opens.
11:30 IST
Opening keynote: OSAT Chip Packaging Summit 2027
Ministry and industry leaders set out the policy outlook.
14:00 IST
Panel: Semiconductors supply chains under pressure
Operators and regulators discuss cost, compliance and lead times.
16:00 IST
Workshop: Turning policy into orders
Hands-on session on documentation, incentives and finance.
Speakers
- Shalini RaoManaging Director, Titan Company
- Rohini SethiCEO, Dr. Reddy's Laboratories
- Sudha RaghavanManaging Director, Larsen & Toubro
- Karthik SubramanianLogistics & Ports Reporter, IGEN News
- Lakshmi VenkatesanAgri & Food Trade Reporter, IGEN News
- Vikram MalhotraIndustry Analyst, Manufacturing, IGEN Intelligence
Sponsors and exhibiting companies
Venue and map
Marina Bay Sands Expo
Marina Bay Sands Expo, Singapore, India
Nearest metro and parking details are included in the confirmation email. Map preview is a placeholder in this demo.
FAQ
Exporters, importers, trade finance and logistics teams, policy advisers and investors working in semiconductors.