OSAT Chip Packaging Summit 2027 Webinar Series Webinar Series Webinar Series Web
- Date
- 24 Jan 2027
- Venue
- IGEN Live (online)
- Organizer
- IGEN News Editorial
09:00 IST
Online
1,711 expected
About this event
OSAT Chip Packaging Summit 2027 Webinar Series Webinar Series Webinar Series Web brings together exporters, policymakers, investors and technology providers to work through what is changing in semiconductors and what to do about it. The programme is built around practical sessions rather than speeches.
Delegates leave with a shortlist of buyers and partners, a clear reading of upcoming notifications, and access to the IGEN briefing pack and recordings.
Agenda
09:00 IST
Welcome and market snapshot
Moderator frames the three questions the session will answer.
09:10 IST
Case studies
Three semiconductors operators share what worked.
09:35 IST
Live Q&A
Readers put questions to the panel.
Speakers
- Arvind MenonChief Strategy Officer, HCLTech
- Anita DeshmukhManaging Director, Vedanta
- Nikhil KamathChief Strategy Officer, JSW Steel
- Ananya RaoEnergy & Climate Correspondent, IGEN News
- Imran QureshiGulf & West Asia Bureau Chief, IGEN News
- Dr. Arjan MehtaChief Analyst, Hardware & Supply Chains, IGEN Intelligence
Sponsors and exhibiting companies
How to join
IGEN Live (online)
Join link is emailed after registration
A personal join link is sent to your email after registration.
FAQ
Exporters, importers, trade finance and logistics teams, policy advisers and investors working in semiconductors.