OSAT Semiconductor Packaging Summit 2026
- Date
- 8 May 2027
- Venue
- Pune International Centre
- Organizer
- IGEN SME Network
10:00 IST
Pune
1,271 expected
About this event
OSAT Semiconductor Packaging Summit 2026 brings together exporters, policymakers, investors and technology providers to work through what is changing in semiconductors and what to do about it. The programme is built around practical sessions rather than speeches.
Delegates leave with a shortlist of buyers and partners, a clear reading of upcoming notifications, and access to the IGEN briefing pack and recordings.
Agenda
10:00 IST
Registration and networking breakfast
Badge pick-up, buyer-seller lounge opens.
11:30 IST
Opening keynote: OSAT Semiconductor Packaging Summit 2026
Ministry and industry leaders set out the policy outlook.
14:00 IST
Panel: Semiconductors supply chains under pressure
Operators and regulators discuss cost, compliance and lead times.
16:00 IST
Workshop: Turning policy into orders
Hands-on session on documentation, incentives and finance.
Speakers
- Kavita JoshiChief Strategy Officer, JSW Steel
- Sudha RaghavanChief Strategy Officer, Larsen & Toubro
- Vivek AnandChairperson, Tata Power
- Priya NambiarPolicy Editor, IGEN News
- Dr. Arjan MehtaChief Analyst, Hardware & Supply Chains, IGEN Intelligence
- Vikram MalhotraIndustry Analyst, Manufacturing, IGEN Intelligence
Sponsors and exhibiting companies
Venue and map
Pune International Centre
Pune International Centre, Pune, India
Nearest metro and parking details are included in the confirmation email. Map preview is a placeholder in this demo.
FAQ
Exporters, importers, trade finance and logistics teams, policy advisers and investors working in semiconductors.