Investment opportunityOpenRef IGEN/INV/2026/2116
OSAT Packaging Testbed Engineering Advisory
- Issued by
- Ministry of Heavy Industries
- Value
- $605 million
- Deadline
- 20 Feb 2027
- Country and sector
- India · Semiconductors
Overview
Ministry of Heavy Industries invites qualified Indian organisations to respond to OSAT Packaging Testbed Engineering Advisory. The opportunity sits in semiconductors and is open to registered companies with relevant experience and a clean compliance record.
Eligibility
- Registered legal entity with at least 5 years of operating history in semiconductors
- Average annual turnover of $41 million or more over the last three years
- No debarment or pending litigation with the issuing body
- Valid tax, GST and statutory registrations; ISO 9001 or equivalent preferred
Scope of work
- Equity or structured debt participation
- Phase-wise capital deployment against milestones
- Offtake agreements in place for 60% of capacity
- Board observer seat for lead investor
Documents
Notice
osat-packaging-testbed-enginee-notice.txt · 84 KB
Technical specification
osat-packaging-testbed-enginee-technical-specification.txt · 1.2 MB
Evaluation criteria
osat-packaging-testbed-enginee-evaluation-criteria.txt · 210 KB
Form
osat-packaging-testbed-enginee-application-form.txt · 46 KB
Timeline
12 Oct 2026
Notice published
10 Feb 2027
Pre-bid clarifications close
20 Feb 2027
Submission deadline
10 Mar 2027
Shortlist announced
20 Apr 2027
Award and onboarding