Semiconductor Sovereignty: Scaling Commercial Wafer Fabs & OSAT Packaging in India
Executive Summary
Senior government leadership and silicon manufacturing executives evaluate India's march from legacy assembly to commercial 28nm/40nm wafer fabrication, cleanroom chemical supply chains, and domestic compound semiconductor packaging.
Key Discussion Points
- 1Commercial wafer production schedules at Dholera and Sanand are tracking ahead of target timelines for initial silicon runs.
- 2Domestic consumption of semiconductor components in automotive EV power stages and smart energy meters will absorb 42% of domestic packaging throughput.
- 3Ultra-pure chemical supply chains (electronic-grade gases and semiconductor substrates) require targeted capital incentives to de-risk single-source dependencies.
- 4Workforce qualification requires scaling specialized fab engineering diplomas across 100+ technical institutions.
Main Policy & Industry Recommendations
Establish a National Electronic-Grade Chemical Logistics Corridor with fast-track port customs clearances for perishable precursors.
Extend design-linked incentives (DLI) to fabless startups specializing in power semiconductors (SiC and GaN).
Formalise bilateral equipment maintenance agreements with key toolmakers in Japan and the European Union.
Strategic Industry Implications
Accelerates tier-1 automotive and industrial electronics localization, insulating domestic industrial output from international shipping disruption.
Session Transcript
Timestamped recordWelcome distinguished delegates to the Viksit Bharat Delhi session on Semiconductor Sovereignty. In 2021, India laid out its foundational chip manufacturing vision. Today, commercial fabs and OSAT units are taking physical shape across Gujarat, Assam, and Odisha.
The foundational equipment fit-out for our 28-nanometer facility in Dholera is now moving at pace. What surprised many international partners is the speed with which the water purification plant and uninterrupted dual 220kV power lines were delivered.
Packaging is where time-to-market is won. With advanced OSAT, we are delivering flip-chip and ball-grid array modules for commercial automotive clients. Indian automotive OEMs are ready buyers from day one.
From the toolmaker perspective, tool precision depends on supply chain predictability. The customs clearance reforms in Mumbai and Mundra ports have cut our tool arrival-to-fab transit by nearly 70 percent.
Looking ahead to 2047, true sovereignty is not just fabricating chips designed abroad, but possessing the IP, EDA tool competency, and compound materials engineering within the country.
Let us turn to human capital. Without specialized cleanroom technicians, capital investment idle. We are integrating fab cleanroom simulations across state engineering colleges.
Dr. R. Ramanathan
Senior Adviser, Electronics & Digital Infrastructure
NITI Aayog
Vikram Shenoy
VerifiedManaging Director
Bharat Wafer Fab Consortium
Semiconductor Operations
Ananya Deshmukh
VerifiedHead of OSAT Technology
Tata Electronics Advanced Packaging
Substrate & Packaging Systems
Kenji Takahashi
VerifiedDirector of International Supply Chains
Tokyo Electron Alliance
Lithography & Cleanroom Equipment
- ›India Semiconductor Mission (ISM) Phase 2 allocation notification.
- ›Customs Duty Notification 24/2026 on silicon packaging equipment exemptions.